Rogers RO3003 2-Layer 0.3mm Thin PCB for Automotive Radar & 5G mmWave Applications
1.Introduction of RO3003
Rogers RO3003 high-frequency laminates are ceramic-filled PTFE composites designed for commercial microwave and RF applications. RO3003 laminates deliver excellent stability of dielectric constant (Dk) across a wide range of temperatures and frequencies. This stability includes the elimination of the step change in Dk typically observed near room temperature with PTFE glass materials, making it an ideal substrate for automotive radar systems (77 GHz), Advanced Driver Assistance Systems (ADAS), and 5G wireless infrastructure in the mmWave frequency range.
2.Key Features
Material Composition: Ceramic-filled PTFE composite
Dielectric Constant: 3.00 ±0.04 at 10 GHz/23°C
Dissipation Factor: 0.001 at 10 GHz/23°C
Decomposition Temperature (Td): >500°C
Thermal Conductivity: 0.5 W/mK
Moisture Absorption: 0.04%
Coefficient of Thermal Expansion (CTE):
X-axis: 17 ppm/°C
Y-axis: 16 ppm/°C
Z-axis: 25 ppm/°C
(measured from -55°C to 288°C)
3.Benefits of Using RO3003 in PCB Design
Low Dielectric Loss: Suitable for high-frequency applications up to 77 GHz.
Excellent Mechanical Stability: Reliable performance in stripline and multilayer constructions across temperature variations.
Uniform Mechanical Properties: Enables hybrid multilayer designs with different dielectric constants.
Stable Dk vs. Temperature & Frequency: Ideal for bandpass filters, microstrip patch antennas, and voltage-controlled oscillators.
Low In-Plane CTE (Matched to Copper): Enhances reliability of surface-mount assemblies and dimensional stability.
Cost-Effective Volume Production: Economical laminate pricing with scalable manufacturing.
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RO3003 |
| Layer Count | 2 layers |
| Board Dimensions | 254mm × 142mm |
| Minimum Trace/Space | 5/4 mils |
| Minimum Hole Size | 0.2mm |
| Blind Vias | No |
| Finished Board Thickness | 0.3mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20µm |
| Surface Finish | Silver plate / Gold plate (ENIG) |
| Top Silkscreen | No |
| Bottom Silkscreen | White |
| Top Solder Mask | No |
| Bottom Solder Mask | Green |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1: 35µm
Rogers RO3003 Core: 10mil (0.254mm)
Copper layer 2: 35µm
6.PCB Statistics:
Components: 150
Total Pads: 300
Thru-Hole Pads: 200
Top SMT Pads: 100
Bottom SMT Pads: 0
Vias: 250
Nets: 2
7.Typical Applications
Automotive radar systems (77 GHz)
Global Positioning Satellite (GPS) antennas
Cellular telecommunications systems (power amplifiers & antennas)
Patch antennas for wireless communications
Direct broadcast satellites
Datalink over cable systems
Remote meter readers
Power backplanes
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
